发明名称 |
Heat-dissipating fin assembly with heat-conducting structure |
摘要 |
The present invention relates to a heat-dissipating fin capable of increasing surface turbulence, which includes a first heat-dissipating fin (10) and a second heat-dissipating fin (20). A first surface (11) of the first heat-dissipating fin (10) is provided with a plurality of first protrusions (12) arranged at intervals. The second heat-dissipating fin (20) has a second surface (21) toward the first surface (11). The second surface (21) is also provided with a plurality of second protrusions (22) arranged at intervals. The second protrusions (22) are arranged to correspond to the first protrusions (12). The second heat-dissipating fin (20) is overlapped with the first heat-dissipating fin (10). With the arrangement of the first protrusions (12) and the second protrusions (22), the heat-dissipating area of the first heat-dissipating fin (10) and the second heat-dissipating fin (20) can be increased so as to increase the surface turbulence. Thus, the heat-exchange efficiency can be enhanced. |
申请公布号 |
EP2299488(B1) |
申请公布日期 |
2014.07.23 |
申请号 |
EP20090010167 |
申请日期 |
2009.08.06 |
申请人 |
CPUMATE INC.;GOLDEN SUN NEWS TECHNIQUES CO., LTD. |
发明人 |
LIN, KUO-LEN;CHENG, CHIH-HUNG |
分类号 |
H01L23/427;F28D15/02;F28F1/32;F28F13/06;H01L23/367 |
主分类号 |
H01L23/427 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|