发明名称 Heat-dissipating fin assembly with heat-conducting structure
摘要 The present invention relates to a heat-dissipating fin capable of increasing surface turbulence, which includes a first heat-dissipating fin (10) and a second heat-dissipating fin (20). A first surface (11) of the first heat-dissipating fin (10) is provided with a plurality of first protrusions (12) arranged at intervals. The second heat-dissipating fin (20) has a second surface (21) toward the first surface (11). The second surface (21) is also provided with a plurality of second protrusions (22) arranged at intervals. The second protrusions (22) are arranged to correspond to the first protrusions (12). The second heat-dissipating fin (20) is overlapped with the first heat-dissipating fin (10). With the arrangement of the first protrusions (12) and the second protrusions (22), the heat-dissipating area of the first heat-dissipating fin (10) and the second heat-dissipating fin (20) can be increased so as to increase the surface turbulence. Thus, the heat-exchange efficiency can be enhanced.
申请公布号 EP2299488(B1) 申请公布日期 2014.07.23
申请号 EP20090010167 申请日期 2009.08.06
申请人 CPUMATE INC.;GOLDEN SUN NEWS TECHNIQUES CO., LTD. 发明人 LIN, KUO-LEN;CHENG, CHIH-HUNG
分类号 H01L23/427;F28D15/02;F28F1/32;F28F13/06;H01L23/367 主分类号 H01L23/427
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