发明名称
摘要 The invention provides copper alloy for electrical and electronic components, and a method for producing the same, wherein a simplified copper alloy manufacturing method is provided and the copper alloy for electrical and electronic components is excellent in strength, electric conductivity and electrical-resistance. The copper alloy contains 2.1-2.6% of Fe by weight, 0.015-0.15% of P by weight, 0.05-0.20% of Zn by weight, and the rest is composed of Cu and unavoidable impurities. In a Fe precipitate dispersed in a Cu master phase, the Fe precipitate with the single area thereof to be within the range of 20 nm2-200 nm2 and the total area of the Fe precipitate is over 0.4 % relative to the whole area of the Cu master phase. When the single area thereof to be within the range of over 200 nm2, the total area of the Fe precipitate is 0.4 < = s1/ s2 < = 1 relative to the whole area of the Cu master phase.
申请公布号 JP5555154(B2) 申请公布日期 2014.07.23
申请号 JP20100290659 申请日期 2010.12.27
申请人 发明人
分类号 C22C9/00;C22F1/00;C22F1/08;H01B1/02;H01B13/00 主分类号 C22C9/00
代理机构 代理人
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