Biometric sensor and sensor panel, method for detecting biometric pattern using the same, and method for manufacturing the same

摘要

A biometric sensor panel includes (a) a first flexible substrate, (b) a plurality of first electrodes formed on the first flexible substrate, the first electrodes being arranged in a first direction, (c) a semiconductor layer formed on the first electrodes, (d) a second flexible substrate, (e) a plurality of second electrodes formed on the second flexible substrate, the second electrodes being arranged in a second direction crossing the first direction, and (f) a pressure sensitive conductive layer formed on the second electrodes, wherein the first and second flexible substrates face each other such that the semiconductor layer is in contact with the pressure sensitive conductive layer.

主权项

1. A biometric sensor panel, comprising:
a first flexible substrate; a plurality of first electrodes formed on the first flexible substrate, the first electrodes being arranged in a first direction; a first insulation layer formed on the first electrodes over the first flexible substrate; a plurality of first contact pads formed on the first insulation layer, the first contact pads aligned with the first electrodes and connected to corresponding ones of the first electrodes through vias formed in the first insulation layer; a semiconductor layer formed on the first contact pads over the first insulation layer; a second flexible substrate; a plurality of second electrodes formed on the second flexible substrate, the second electrodes being arranged in a second direction crossing the first direction; a second insulation layer formed on the second electrodes over the second flexible substrate; a plurality of second contact pads formed on the second insulation layer, the second contact pads aligned with the second electrodes and connected to corresponding ones of the second electrodes through vias formed in the second insulation layer; and a pressure sensitive conductive layer, wherein the first and second flexible substrates face each other such that each of the first contact pads is aligned with a corresponding one of the second contact pads via the semiconductor layer and the pressure sensitive conductive layer sandwiched therebetween.