| 摘要 |
The present invention relates to a semiconductor test device. The semiconductor test device includes a guide plate having a plurality of guide holes and conductive wire support holes formed at one side thereof; a plurality of test pins inserted into the guide holes and having low ends electrically coming into contact with a target semiconductor; at least one conductive wire inserted into the conductive wire support holes and disposed at a periphery of a power test pin or a signal test pin among the test pins; and a conductive connecting means for electrically connecting a ground test pin of the test pins to the conductive wire. According to the present invention, electrical signals transferred through each of the test pins for transferring signals to the target semiconductor are prevented from interfering with each other. Therefore, the test reliability of the target semiconductor may be improved. In addition, the high-frequency properties of the target semiconductor may be accurately measured. |
