发明名称 Memory cooler
摘要 A cooler for a memory module includes heat plates on the sides of the memory module and heat fins extending from the top of the heat plates. The heat fins are optimized according to simulated or actual airflow about the memory module inside an enclosure. The heat fins may curve diagonally outward from the memory module and their free ends may be arranged substantially parallel to the airflow so air flows over their larger lateral surfaces down to the memory module.
申请公布号 US8787021(B2) 申请公布日期 2014.07.22
申请号 US201113163369 申请日期 2011.06.17
申请人 Hewlett-Packard Development Company, L.P. 发明人 Murakami Vance B.;Htutt Harold Z.
分类号 H05K7/20;F28F7/00;G06F1/20 主分类号 H05K7/20
代理机构 代理人
主权项 1. A cooler for a memory module, comprising: a heat plate having a top edge and an interior side, the interior side for thermally coupling to an exterior side of the memory module; and a row of heat fins extending upward from the top edge, the heat fins being strips that are curved diagonally away from the heat plate and twisted so their free ends are substantially parallel to a simulated or an actual airflow about the memory module, wherein being curved diagonally away from the heat plate comprises being curved forward along a length of the heat plate and outward from the heat plate.
地址 Houston TX US