发明名称 |
Self-aligned wafer bonding |
摘要 |
A wafer article includes a substrate, two or more hydrophilic areas disposed on the substrate, hydrophobic areas surrounding the hydrophilic areas, and a eutectic bonding material disposed on the substrate. A wafer apparatus including two wafers having complimentary hydrophilic regions and eutectic bonding material is disclosed and a method of forming a bonded wafer articles is disclosed. |
申请公布号 |
US8784975(B2) |
申请公布日期 |
2014.07.22 |
申请号 |
US201313913817 |
申请日期 |
2013.06.10 |
申请人 |
Seagate Technology LLC |
发明人 |
Zheng Jun;Setiadi Dadi |
分类号 |
B32B3/02 |
主分类号 |
B32B3/02 |
代理机构 |
Mueting, Raasch & Gebhardt PA |
代理人 |
Mueting, Raasch & Gebhardt PA |
主权项 |
1. A wafer apparatus comprising:
a first wafer comprising a first substrate and two or more first hydrophilic areas disposed on the first substrate, first hydrophobic areas surrounding the first hydrophilic areas, and a first eutectic bonding material disposed on the first substrate; a second wafer comprising a second substrate and two or more second hydrophilic areas disposed on the second substrate, second hydrophobic areas surrounding the second hydrophilic areas, and a second eutectic bonding material disposed on the second substrate and bonded with the first eutectic bonding material, the first hydrophilic areas aligned with and facing the second hydrophilic areas. |
地址 |
Cupertino CA US |