| 摘要 |
The invention provides a membrane laminated wiring for electronic components, which uses the following covering layer in the membrane laminated wiring using Cu as the main conducting layer, and the covering layer can ensure the close adaptation of a substrate and a baseplate required by the covering layer, and a heat resistance of the upper layer (protection membrane) on the surface of Cu for protecting the main conducting layer, thereby maintaining the low resistance valve even after heating process. A membrane laminated wiring for electronic component is provided, which is for the electronic component of substrate with metal layers, and contains a main conducting layer using Cu as the main component, and a convering layer which covers at least one surface of the main conducting layer, and the composing formula of the atom ratio of the covering layer is Cu100-X-AlX, 20<=X<=60, and the remain is composed of Cu alloy containing inevitable impurities. |
