发明名称 |
Microarchitecture controller for thin-film thermoelectric cooling |
摘要 |
A device having multiple cores executes an algorithm to control Thin-Film Thermoelectric Coolers (TFTEC) that employ the Peltier effect to remove heat from the various cores of the multi-core processor. The algorithms may combine Thread Migration (TM) and Dynamic Voltage/Frequency Scaling (DVFS) to provide Dynamic Thermal Management (DTM) and TFTEC control. |
申请公布号 |
US8788860(B2) |
申请公布日期 |
2014.07.22 |
申请号 |
US201213600791 |
申请日期 |
2012.08.31 |
申请人 |
Intel Corporation |
发明人 |
Monferrer Pedro Chaparro;González José |
分类号 |
G06F1/20;G06F1/32 |
主分类号 |
G06F1/20 |
代理机构 |
Trop, Pruner & Hu, P.C. |
代理人 |
Trop, Pruner & Hu, P.C. |
主权项 |
1. A processor comprising:
a plurality of cores; a plurality of Thin-Film Thermoelectric Coolers (TFTECs) to dissipate heat from the processor; and a power manager to receive thermal information from one or more on-die thermal sensors, and to execute a control algorithm to:
control a current supplied to at least one of the plurality of TFTECs based at least in part on the thermal information;identify a first core that has a first low-power thread;enable a first TFTEC that is allocated to the first core, wherein upon enablement the first TFTEC is to remove heat from the first core to produce a pre-cooled first core; andthereafter migrate a first high-power thread from a second core to the pre-cooled first core. |
地址 |
Santa Clara CA US |