发明名称 Microarchitecture controller for thin-film thermoelectric cooling
摘要 A device having multiple cores executes an algorithm to control Thin-Film Thermoelectric Coolers (TFTEC) that employ the Peltier effect to remove heat from the various cores of the multi-core processor. The algorithms may combine Thread Migration (TM) and Dynamic Voltage/Frequency Scaling (DVFS) to provide Dynamic Thermal Management (DTM) and TFTEC control.
申请公布号 US8788860(B2) 申请公布日期 2014.07.22
申请号 US201213600791 申请日期 2012.08.31
申请人 Intel Corporation 发明人 Monferrer Pedro Chaparro;González José
分类号 G06F1/20;G06F1/32 主分类号 G06F1/20
代理机构 Trop, Pruner & Hu, P.C. 代理人 Trop, Pruner & Hu, P.C.
主权项 1. A processor comprising: a plurality of cores; a plurality of Thin-Film Thermoelectric Coolers (TFTECs) to dissipate heat from the processor; and a power manager to receive thermal information from one or more on-die thermal sensors, and to execute a control algorithm to: control a current supplied to at least one of the plurality of TFTECs based at least in part on the thermal information;identify a first core that has a first low-power thread;enable a first TFTEC that is allocated to the first core, wherein upon enablement the first TFTEC is to remove heat from the first core to produce a pre-cooled first core; andthereafter migrate a first high-power thread from a second core to the pre-cooled first core.
地址 Santa Clara CA US