| 摘要 |
A die bonding device having a buffer stage comprises: a wafer stage for supporting a wafer divided into multiple dies; a porous chuck arranged in one side of the wafer stage and formed of porous substances to place the dies separated from the wafers thereon and to adsorb the dies with vacuum pressure; a buffer stage capable of placing the porous chuck thereon and having a panel on which a pneumatic pipe for providing the vacuum pressure through the porous chuck is arranged; and a die transfer part for transferring the dies from the wafers to the buffer stage and also transferring the dies to bond the dies on the buffer stage to a substrate. One or more vacuum holes are arranged in the porous chuck. A vacuum sensor for measuring the degree of vacuum is arranged in the pneumatic pipe. |
