发明名称 Method for forming polycrystalline film, polycrystalline film and thin film transistor fabricated from the polycrystalline film
摘要 A method for forming a polycrystalline film, a polycrystalline film formed by the method and a thin film transistor fabricated from the polycrystalline film are provided. The method comprises the steps of: providing a substrate; forming a thermal conductor layer on the substrate; etching the thermal conductor layer until the substrate is exposed to form a thermal conductor pattern; forming a seed layer on the thermal conductor layer and the substrate; etching the seed layer to form seed crystals on both sidewalls of the thermal conductor; forming an amorphous layer on the substrate, the thermal conductor layer and the seed crystals; etching the amorphous layer; and recrystallizing the amorphous layer to form a polycrystalline layer.
申请公布号 US8785938(B2) 申请公布日期 2014.07.22
申请号 US201213583851 申请日期 2012.08.02
申请人 Tsinghua University 发明人 Zhao Lianfeng;Liang Renrong;Zhao Mei;Wang Jing;Xu Jun
分类号 H01L29/786;H01L29/04 主分类号 H01L29/786
代理机构 Westman, Champlin & Koehler, P.A. 代理人 Brush David D.;Westman, Champlin & Koehler, P.A.
主权项 1. A method for forming a polycrystalline film, comprising steps of: providing a substrate; forming a thermal conductor layer on the substrate; etching the thermal conductor layer until the substrate is exposed to form a thermal conductor pattern; forming a seed layer on the thermal conductor layer and the substrate; etching the seed layer to form seed crystals on both sidewalls of the thermal conductor layer; forming an amorphous layer on the substrate, the thermal conductor layer and the seed crystals; etching the amorphous layer; and recrystallizing the amorphous layer to form a polycrystalline layer.
地址 Beijing CN
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