| 摘要 |
The purpose of the present invention is to provide a flexible circuit copper-clad laminate with excellent etching characteristics, peel strength, and curl characteristics. The flexible circuit copper-clad laminate according to the present invention includes a polymer film, a tie-coat layer formed on at least one surface of the polymer film, and a copper (Cu) layer formed on the tie-coat layer. The tie-coat layer is composed of an alloy containing 6.0-7.0 wt% of molybdenum (Mo), 0.5-10.0 wt% of niobium (Nb), and a remaining part of nickel (Ni). |
