Coupling of speakers with integrated circuit

摘要

Systems and methods for a low pin architecture to couple speakers with integrated circuits are disclosed herein. In an implementation, the low pin architecture facilitates in reducing the required pin interfaces to couple a low power speaker, a high power speaker, and earphone speakers with integrated circuits (ICs). For this, the high power speaker can be cross-coupled between the pin interfaces that are coupled to the low power speaker and the earphone speakers. These pin interfaces are driven by corresponding driver circuits. In said implementation, some of the driver circuits can be shared to drive multiple pin interfaces. These shared driver circuits include a combined cascode circuit having a first cascode circuit integrated with a second cascode circuit to reliably and selectively drive one or more of the pin interfaces.

主权项

1. A system comprising:
first, second, and third pin interfaces; a first device coupled between the first and second pin interfaces; a second device that is coupled to the first pin interface and shares the first pin interface with the first device; a first driver circuit shared between the first pin interface and the third pin interface, wherein the first driver circuit includes a first combined cascode circuit including at least two cascode circuits to selectively drive the first pin interface or the third pin interface; a fourth pin interface and a second driver circuit shared between the second pin interface and the fourth pin interface, wherein the second driver circuit includes a second combined cascode circuit to selectively drive one of the second pin interface and the fourth pin interface; a third device, wherein the second device is coupled to the fourth pin interface and shares the fourth pin interface with the third device; wherein the first device is a low power speaker, the second device is a high power speaker and the third device is an earphone speaker coupled to the mobile device.