Metal-based circuit board

摘要

A metal-based circuit board, which reduces the influence of thermal expansion, is provided having a structure where an insulating layer A having a large coefficient of thermal expansion is sandwiched between insulating layers B having a small coefficient of thermal expansion. Such a structure allows the insulating layers B to contract and expand so as to suppress contraction and expansion of the insulating layer A and thereby reduce the stress in the direction of negating the stress. As a result, while warpage or distortion is suppressed to be minimal, the bonding strength of the upper and the lower layer is maintained, and degree of freedom for circuit design is not impaired, thereby providing a highly reliable circuit structure.

主权项

1. A metal-based circuit board comprising a first conductor layer formed on a substrate made of a metal material via an insulating layer, and a second conductor layer formed on the first conductor layer via an insulating layer; wherein the insulating layer between the first and the second conductor layer comprises a first intermediate insulating layer and second intermediate insulating layers, and has a structure of the first intermediate insulating layer sandwiched between the second intermediate insulating layers; wherein coefficient of thermal expansion of the first intermediate insulating layer is larger than that of the second intermediate insulating layers.