Package with a fan-out structure and method of forming the same

摘要

An embodiment is a device comprising a semiconductor die, an adhesive layer on a first side of the semiconductor die, and a molding compound surrounding the semiconductor die and the adhesive layer, wherein the molding compound is at a same level as the adhesive layer. The device further comprises a first post-passivation interconnect (PPI) electrically coupled to a second side of the semiconductor die, and a first connector electrically coupled to the first PPI, wherein the first connector is over and aligned to the molding compound.

主权项

1. A method of forming a semiconductor device comprising:
forming a die, attaching the die over a dicing tape with an adhesive layer; singulating the die; de-bonding the die from the dicing tape; attaching the die over a carrier with the adhesive layer, wherein the adhesive layer is coterminous with the die; molding the die with a polymer, wherein the polymer encircles the die and the adhesive layer; forming a connector over and aligned to the polymer, wherein the connector is electrically coupled to the die; de-bonding the die from the carrier; bonding a coating tape to the die on a side opposite the connector; and singulating the die with the connector to form the semiconductor device.