Electronic component and electronic device

摘要

An electronic component to be mounted on a substrate, including an electronic component-side land that faces a substrate-side land provided on the substrate when the electronic component is mounted on the substrate. A non-soldered region is provided on a surface of the electronic component-side land, facing the substrate-side land, so that a shape of the substrate-side land is different from a shape of the electronic component-side land facing the substrate-side land.

主权项

1. An electronic component to be mounted on a substrate, comprising:
a plurality of component-side lands having areas of different sizes, one of the electronic component-side lands faces a substrate-side land provided on the substrate when the electronic component is mounted on the substrate, wherein a non-soldered region is provided on a surface of the one electronic component-side land, facing the substrate-side land, so that a shape of the substrate-side land is different from a shape of the one electronic component-side land facing the substrate-side land, wherein the non-soldered region is provided on the one electronic component-side land which has the largest area among the plurality of electronic component-side lands.