发明名称 |
Two step poly etch LDMOS gate formation |
摘要 |
A method of making a transistor includes etching a first side of a gate, the gate including an oxide layer formed over a substrate and a conductive material formed over the oxide layer, the etching removing a first portion of the conductive material, implanting an impurity region into the substrate such that the impurity region is self-aligned, and etching a second side of the gate to remove a second portion of the conductive material. |
申请公布号 |
US8785282(B2) |
申请公布日期 |
2014.07.22 |
申请号 |
US201314094505 |
申请日期 |
2013.12.02 |
申请人 |
Volterra Semiconductor Corporation |
发明人 |
Zuniga Marco A. |
分类号 |
H01L21/336 |
主分类号 |
H01L21/336 |
代理机构 |
Lathrop & Gage LLP |
代理人 |
Lathrop & Gage LLP |
主权项 |
1. A method of making a integrated circuit, comprising:
forming a plurality of LDMOS transistors on a substrate, each LDMOS transistor including a gate oxide layer comprising a first side closer to a source side of the LDMOS transistor and a second side closer to the drain side of the LDMOS transistor, the first side having a thickness of less than about 100 Å, and the second side having a thickness equal to or greater than 125 Å; forming a plurality of CMOS transistor on the substrate, wherein each CMOS transistor includes a gate oxide layer, and wherein forming the gate oxide layer of the CMOS transistor occurs simultaneously with forming the first side of the gate oxide layer of the LDMOS transistor. |
地址 |
San Jose CA US |