Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die

摘要

A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.

主权项

1. A method of making a semiconductor device, comprising:
providing a substrate; disposing a semiconductor die over the substrate; disposing a dispensing needle in fluid communication with the semiconductor die, the dispensing needle including a width substantially equal to a width of the semiconductor die; and dispensing an underfill material from the dispensing needle between the semiconductor die and substrate.