发明名称 |
Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same |
摘要 |
An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer. |
申请公布号 |
US8785956(B2) |
申请公布日期 |
2014.07.22 |
申请号 |
US201213560842 |
申请日期 |
2012.07.27 |
申请人 |
|
发明人 |
Shiu Chuan-Jin;Lin Po-Shen;Chang Yi-Ming;Yang Hui-Ching;Lai Chiung-Lin |
分类号 |
H01L33/00;H01L21/00;H01L33/52;H01L27/146;H01L23/00 |
主分类号 |
H01L33/00 |
代理机构 |
Liu & Liu |
代理人 |
Liu & Liu |
主权项 |
1. A chip package, comprising:
a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a through-hole extending from the second surface to the first surface; a conducting layer disposed on the substrate, having a portion overlying both sidewalls and a bottom of the through-hole, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer, wherein the through-hole is partially filled with the first light shielding layer such that a void is formed between the bottom of the through-hole and the first light shielding layer in the through-hole, and wherein the portion of the conducting layer, which overlies both sidewalls and the bottom of the through-hole, directly contacts the void. |
地址 |
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