发明名称 Method of forming a conductive image on a non-conductive surface
摘要 The present invention relates to a method for forming a raised conductive image on a non-conductive or dielectric surface, the method comprising placing a metal coordination complex on a surface of the substrate, exposing the surface to electromagnetic radiation, reducing the exposed complex. removing unexposed complex leaving an elemental metal image, removing unexposed metal complex and then plating the resulting elemental metal image with a highly conductive material.
申请公布号 US8784953(B2) 申请公布日期 2014.07.22
申请号 US201213587785 申请日期 2012.08.16
申请人 Earthone Circuit Technologies Corporation 发明人 Wismann William
分类号 C23C18/18;C23C18/22;H05K3/10;C23C18/16;H05K3/18;H01L21/288;H01L21/768;H05K3/38 主分类号 C23C18/18
代理机构 One LLP 代理人 One LLP
主权项 1. A method of forming a layer of conductive material on a substrate surface, the method comprising: activating at least a portion of the substrate surface; depositing a metal coordination complex on a part of the activated portion of the surface; applying a magnetic field to the metal coordination complex that is located on part of the activated portion of the substrate surface to align molecules of the metal coordination complex with the magnetic field; exposing the metal coordination complex to electromagnetic radiation; reducing the metal coordination complex to elemental metal; removing unreduced metal coordination complex from the surface; drying the surface; and depositing a conductive material onto the surface; wherein the magnetic field is removed prior to the depositing the conductive material onto the surface.
地址 Carlsbad CA US