发明名称 |
STRUCTURE OF BATTERY PROTECTION CIRCUITS MODULE PACKAGE WITH HOLDER, BATTERY PACK INCLUDING THE SAME, AND METHODS FOR FABRICATING THEREOF |
摘要 |
The present invention relates to a structure of a battery protection circuit module package and a battery protection circuit module package assembly which are advantageous in terms of integration and minimization. The battery protection circuit module package assembly includes: a battery protection circuit module package having a lead frame constituted by a plurality of leads spaced apart from each other, a protection circuit component on the lead frame, and an encapsulant to encapsulate the protection circuit component; and a holder, which is coupled with the battery protection circuit module package by insert injection molding, wherein the battery protection circuit module package is disposed inside a first injection mold and a melted resin injected into the mold. |
申请公布号 |
KR101420827(B1) |
申请公布日期 |
2014.07.21 |
申请号 |
KR20130085169 |
申请日期 |
2013.07.19 |
申请人 |
ITM SEMICONDUCTOR CO., LTD. |
发明人 |
NA, HYUK HWI;HWANG, HO SUK;PARK, JONG WOON;KANG, HYANG WON;PARK, SEUNG YONG;SONG, SUNG HO |
分类号 |
H01M2/34;H01M2/30 |
主分类号 |
H01M2/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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