发明名称 STRUCTURE OF BATTERY PROTECTION CIRCUITS MODULE PACKAGE WITH HOLDER, BATTERY PACK INCLUDING THE SAME, AND METHODS FOR FABRICATING THEREOF
摘要 The present invention relates to a structure of a battery protection circuit module package and a battery protection circuit module package assembly which are advantageous in terms of integration and minimization. The battery protection circuit module package assembly includes: a battery protection circuit module package having a lead frame constituted by a plurality of leads spaced apart from each other, a protection circuit component on the lead frame, and an encapsulant to encapsulate the protection circuit component; and a holder, which is coupled with the battery protection circuit module package by insert injection molding, wherein the battery protection circuit module package is disposed inside a first injection mold and a melted resin injected into the mold.
申请公布号 KR101420827(B1) 申请公布日期 2014.07.21
申请号 KR20130085169 申请日期 2013.07.19
申请人 ITM SEMICONDUCTOR CO., LTD. 发明人 NA, HYUK HWI;HWANG, HO SUK;PARK, JONG WOON;KANG, HYANG WON;PARK, SEUNG YONG;SONG, SUNG HO
分类号 H01M2/34;H01M2/30 主分类号 H01M2/34
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