摘要 |
An electronic component mounting apparatus includes a loading unit which loads a printed circuit board. The apparatus includes a first substrate moving unit which moves the printed circuit board loaded by the loading unit in a Y-direction. The apparatus includes a substrate holding unit which temporarily holds the printed circuit board moved by the first substrate moving unit. The apparatus includes a component mounting unit which mounts an electronic component on the printed circuit board. The apparatus includes a second substrate moving unit which moves the printed circuit board with the electronic component mounted thereon in the Y-direction. The apparatus includes an unloading unit which moves the printed circuit board moved by the second substrate moving unit in the X-direction to unload the printed circuit board. The present invention can provide an electronic component mounting apparatus which is compact in a transfer direction for transferring the printed circuit board. |