LIQUID COOLING SYSTEM FOR MULTIPROCESSOR COMPUTATION COMPLEX, PACKAGE AND HEAT SINK MODULE

摘要

FIELD: heating.SUBSTANCE: liquid head sink module comprises top and bottom parts soldered together. Rectangular recesses are cut on the surface of said parts and shaped to pcb electronic components to be fitted therein thereafter. Said module is provided with inner feed and discharge channels. Note here that one end of feed and discharge hoses are rigidly connected by one-piece union with heat sink module. Opposite end of said hoses are connected to inlet and outlet unions of pipelines to feed and discharge heat carrier via fast-release connector. Note also that said package comprises pcb of electronic components mounted on both sides of said heat sink to ensure optimum interface and thermal interface material arranged between heat sink and pcb electronic components.EFFECT: efficient heat sink, perfected design.16 cl, 6 dwg, 1 tbl, 1 ex