WIRE SAW AND METHOD FOR SLICING INGOT USING THE SAME

摘要

Disclosed are a wire saw device capable of improving the variation quality of the thickness and warpage of a wafer, and a method for slicing an ingot using the same. According to an embodiment of the present invention, the wire saw device comprises the following: an ingot mounting unit, to which an ingot is attached for supporting the ingot; at least two rollers arranged at a constant distance away from the lower part of the ingot; and an abrasive particle-electrodepositing wire wound in the separated roller. At least two rollers comprise an initial end and a secondary end located in the opposite direction of the initial end respectively. The abrasive particle-electrodepositing wire is supplied from direction of the first end and collected into the direction of the second end. A dressing member is arranged on one side of the ingot adjacent to the first end, which is a part initially in contact with the supplied abrasive particle-electrodepositing wire. According to an embodiment of the present invention, the method for slicing an ingot comprises the following: a step for supplying the abrasive particle-electrodepositing wire to the roller; a step for dressing the abrasive particle-electrodepositing wire by using the dressing member before the abrasive particle-electrodepositing wire is in contact with the ingot; and a step for cutting the ingot by using the dressed abrasive particle-electrodepositing wire.