LIGHT EMITTING MODULE

摘要

A light emitting module with improved heat dissipation is disclosed. The light emitting module, according to an embodiment of the present invention, comprises: a substrate; and a light emitting device package which is arranged on the upper side of the substrate. The substrate includes a support plate which supports the light emitting device package. A heat transfer material is arranged on the support plate. The support plate includes a plurality of support units which pass through the heat transfer material.