| 摘要 |
The present invention provides a heat-curable silicone resin composition that yields a cured product with excellent transparency and minimal discoloration over time, which is ideal as a protective material or lens material or the like for a light emitting diode element. The present invention provides a heat-curable silicone composition, comprising:
(A) an organopolysiloxane having at least one structure represented by a general formula shown below within each molecule:
(wherein, m represents an integer of 0, 1 or 2, R 1 represents a hydrogen atom, phenyl group or halogenated phenyl group, R 2 represents a hydrogen atom or methyl group, R 3 represents a monovalent organic group of 1 to 10 carbon atoms, Z 1 represents a bivalent group represented by -R 4 -, -R 4 O- or -R 4 (CH 3 ) 2 SiO- (wherein, R 4 represents a bivalent organic group of 1 to 10 carbon atoms), and Z 2 represents an oxygen atom or a bivalent organic group of 1 to 10 carbon atoms), and
(B) a quantity of an organic peroxide that is effective as a curing catalyst. |
