INSULATION RESIN FILM, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD HAVING THE FILM, AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING THE FILM

摘要

The present invention relates to an insulation resin film capable of improving the adhesion strength of a plating layer on a printed circuit board, a metal clad laminate plate and the printed circuit board including the film, and a method for manufacturing the printed circuit board using the insulation resin film. The insulation resin film includes a polyimide resin and an insulation resin layer.