RESIN FOR BLISTER PACKAGE AND PREPARATION METHOD THEREOF

摘要

The present invention relates to a resin for a blister package and a preparation method thereof. The resin for a blister package according to the present invention is a water-soluble resin minimizing harmful factors due to remaining solvents and has good coating properties with respect to a base. Especially, a resin layer formed by using the resin exhibits excellent heat sealing properties inducing little modification under heat sealing temperature conditions.