| 摘要 |
<p>This invention relates to an epoxy resin composition for an insulating film, an insulating film, and a printed circuit board including the same. Particularly in a printed circuit board using a build-up process, a skin layer and a roughness are formed on the surface of the insulating film using different curing starting temperatures, so that peel strength can be enhanced, thus enabling the formation of a fine pattern, and also, a coefficient of thermal expansion of the insulating film is low, thus preventing the deformation of the film.</p> |
