| 发明名称 |
CHIP ARRANGEMENT AND A METHOD FOR FORMING A CHIP ARRANGEMENT |
| 摘要 |
A chip arrangement is provided, the chip arrangement, including: a carrier; at least one chip including at least one contact pad disposed over the carrier; an encapsulation material at least partially surrounding the at least one chip and the carrier; and at least one low temperature co-fired ceramic sheet disposed over a side of the carrier. |
| 申请公布号 |
US2014197523(A1) |
申请公布日期 |
2014.07.17 |
| 申请号 |
US201313742426 |
申请日期 |
2013.01.16 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
Otremba Ralf;Seibt Marco |
| 分类号 |
H01L23/495;H01L21/56 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip arrangement, comprising:
a carrier; at least one chip comprising at least one contact pad disposed over the carrier; an encapsulation material at least partially surrounding the at least one chip and the carrier; and at least one low temperature co-fired ceramic sheet disposed over a side of the carrier. |
| 地址 |
Neubiberg DE |
