| 摘要 |
PROBLEM TO BE SOLVED: To strategically stack chip modules and packages to support miniaturization and memory scalability in both vertical and horizontal orientations.SOLUTION: A controller module with stacked SDRAM modules acts as a controller package 1103. A memory module with stacked flash modules acts as a memory package 1104. Four memory packages stacked together form a memory set 1105. Vertical expansion happens when the controller package is stacked with a single or multiple memory sets, and horizontal expansion happens when the controller package is located on a different site on the PCB relative to the memory sets. Also multiple memory sets can be located on different sites on a PCB. |
