发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT CHIP AND METHOD FOR INSPECTING SEMICONDUCTOR LIGHT-EMITTING ELEMENT CHIP |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light-emitting element chip which determines a semiconductor light-emitting element marked with a defect in a used optical characteristic measurement inspection.SOLUTION: A method for manufacturing a semiconductor light-emitting element chip comprises the steps of: manufacturing a semiconductor bar including a semiconductor light-emitting element (step S10); inspecting the semiconductor light-emitting element (step S20); changing light-emitting characteristics by irradiating the semiconductor light-emitting element with a laser beam when the results of the step S20 indicates a defect (step S30); dividing the semiconductor bar into semiconductor light-emitting element chips (step S40); and applying current to the semiconductor light-emitting element chips, measuring the light intensity of the light emitted from the semiconductor light-emitting element chips, excluding the semiconductor light-emitting element chip with the changed light-emitting characteristics using a current value and the light intensity. |
申请公布号 |
JP2014132619(A) |
申请公布日期 |
2014.07.17 |
申请号 |
JP20130000556 |
申请日期 |
2013.01.07 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
KUMAGAI AKIKO;FURUYA AKIRA;FURUKAWA MASAHITO |
分类号 |
H01L21/66;H01S5/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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