发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT CHIP AND METHOD FOR INSPECTING SEMICONDUCTOR LIGHT-EMITTING ELEMENT CHIP
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light-emitting element chip which determines a semiconductor light-emitting element marked with a defect in a used optical characteristic measurement inspection.SOLUTION: A method for manufacturing a semiconductor light-emitting element chip comprises the steps of: manufacturing a semiconductor bar including a semiconductor light-emitting element (step S10); inspecting the semiconductor light-emitting element (step S20); changing light-emitting characteristics by irradiating the semiconductor light-emitting element with a laser beam when the results of the step S20 indicates a defect (step S30); dividing the semiconductor bar into semiconductor light-emitting element chips (step S40); and applying current to the semiconductor light-emitting element chips, measuring the light intensity of the light emitted from the semiconductor light-emitting element chips, excluding the semiconductor light-emitting element chip with the changed light-emitting characteristics using a current value and the light intensity.
申请公布号 JP2014132619(A) 申请公布日期 2014.07.17
申请号 JP20130000556 申请日期 2013.01.07
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KUMAGAI AKIKO;FURUYA AKIRA;FURUKAWA MASAHITO
分类号 H01L21/66;H01S5/00 主分类号 H01L21/66
代理机构 代理人
主权项
地址