| 摘要 |
<p>The invention relates to a radio-frequency device comprising: an antenna (11) and an integrated-circuit module (29) comprising, on its first face, an upper contact land (25) and on its second face a chip (12) encapsulated in a resin and at least two lower contact lands (23 and 24), and three plastic layers (10, 20 and 30) laminated to one another, the first layer containing the antenna and the module connected to the antenna via the lower contact lands, the second layer containing a cavity (19) of the size of the upper contact land of the module, the second layer being placed on the first layer so as to cover the antenna, and the third layer entirely covering the second layer. According to the main feature of the invention, an additional layer (50) is placed between the first layer (10) and the second layer (20) on the upper contact land (25) of the module (29) so as to cover said land entirely.</p> |
