| 摘要 |
<p>PURPOSE: A method for manufacturing a printed circuit board is provided to increase total area of a ground layer which acts as heat radiation role by forming one ground layer by burying an internal pattern in one side of an internal insulation layer and making the internal pattern contact with a part of an external pattern. CONSTITUTION: According to a method for manufacturing a printed circuit board, a base substrate (110) is prepared. An internal pattern (120) is formed on the base substrate. An internal insulation layer (125) is formed to cover the internal pattern. A printed circuit board constituted with the internal pattern and the internal insulation layer is formed by removing the base substrate. A via hole (124) is formed in the printed circuit board. A via burying the via hole and an external circuit layer (140) including an external pattern (130) on the printed circuit board where the via is formed are formed in sequence. A part of the external pattern contacting with the internal pattern is formed as a ground layer together with the internal pattern.</p> |
