METHOD, DEVICE AND SYSTEM FOR MID-PLANE IMPLEMENTING PARALLEL OPTICAL COMMUNICATION MODULE ON CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a socket configured to be fixed to the front surface of a host circuit board by solder by use of solder reflow processing.SOLUTION: Solder reflow processing is made to be the same as solder reflow processing used for electrically connecting the arrangement of electric contacts placed on the underside of a socket and the arrangement of electric contacts placed on the top surface of a host CB. As the solder reflow processing is an automated processing, processing to fix the socket to the top surface of the host CB is not required to perform manually, but automatically performed as part of a typical automatic front surface technique (SMT) which is a type used generally to implement components on a PCB.