MULTI-CHIP PACKAGE AND INTERPOSER WITH SIGNAL LINE COMPRESSION

摘要

A multi-chip package with signal line compression for testing of the multi-chip package. The multi-chip package includes an interposer and two or more integrated circuits attached to the interposer. The interposer includes multiple data signal lines for data communications between the two integrated circuits. The data signal lines are also coupled to one or more test contacts through an interface circuit. The number of test contacts is smaller than the number of signal lines, which allows a large number of signal lines to be tested with a smaller number of test contacts.

主权项

1. An interposer comprising:
a substrate; a plurality of data signal lines disposed on the substrate; one or more test contact pads disposed on the substrate configured to receive test data signals, the number N of the contact pads being less than the number M of the data signal lines; and a signal interface circuit configured to route the test data signals from the one or more contact pads to the plurality of data signal lines.