| 摘要 |
The present invention provides an insulating resin sheet having a polyimide film, an adhesion layer formed on one surface of the polyimide film, and an insulating resin layer formed on the other one surface of the polyimide film such that the roughness can be formed by means of a desmear process, and also provides a multilayer printed circuit board including the insulating resin sheet, and a method for manufacturing for said circuit board. According to the present invention, a buildup printed circuit board can be provided which can reduce the overall layering thickness, can increase the degree of freedom in designing a substrate, and can achieve a high-density microcircuit pattern. |
