| 摘要 |
The present invention provides an insulation resin sheet, a multilayered printed circuit board including the insulation resin sheet, and a manufacturing method for the same. The insulation resin sheet includes a low temperature expansion type first insulation resin layer containing an inorganic filler and a resin and a second insulation resin layer which is formed on one surface of the first insulation resin layer and which is capable of forming illumination intensity by using a desmear process. The present invention reduces the entire laminated thickness and provides a build-up printed circuit board capable of generating minute circuit patterns of high density while lowering expansion coefficient between layers of the board. |
