| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce size and weight of an image pickup device and a module, as compared with a conventional solid-state image pickup device and a conventional module.SOLUTION: A solid-state image pickup device 1 comprises: a transparent glass substrate 2; and a solid-state image pickup element 3. Conductor pattern 4 is formed on a front surface of the glass substrate 2, and conductor pattern 5 is formed on a back surface of the glass substrate 2. In the glass substrate 2, a through via 6 communicating between front and back conductor patterns 4 and 5 is formed. In the solid-state image pickup element 3, bumps 7 are formed in positions corresponding to the conductor pattern 5, respectively. The solid-state image pickup element 3 is flip-chip bonded to the conductor pattern 5 of the back surface of the glass substrate 2 by the bumps 7. A portion between the periphery of the solid-state image pickup element 3 and the glass substrates 2 is sealed with sealing material 8 such as resin.</p> |
