发明名称 Digital Wireless Data Collection
摘要 The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a portable device. The portable device includes first and second sensors that respectively measure first and second fabrication process parameters. The first fabrication process parameter is different from the second fabrication process parameter. The first and second sensors may communicate the parameters using different and incompatible protocols. The portable device also includes a wireless transceiver that is coupled to the first and second sensors. The wireless transceiver receives the first and second fabrication process parameters and transmits wireless signals containing the first and second fabrication process parameters.
申请公布号 US2014200702(A1) 申请公布日期 2014.07.17
申请号 US201414216224 申请日期 2014.03.17
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Liu Hsu-Shui;Wang Yeh-Chieh;Pai Jiun-Rong;Chen Pei-Nung
分类号 H01L21/02;G05B19/418 主分类号 H01L21/02
代理机构 代理人
主权项 1. An apparatus comprising: a micro-controller having an interface port coupled to a sensor, wherein the interface port is operable to obtain sensor data from the sensor according to a digital protocol, and wherein the micro-controller is operable to modulate the sensor data for wireless transmission; and a wireless transceiver coupled to the microcontroller, wherein the wireless transceiver is operable to: receive the modulated sensor data from the microcontroller;wirelessly communicate the modulated sensor data to a computing system; andwirelessly receive a command to adjust operation of at least one of the sensor and an associated fabrication tool.
地址 Hsin-Chu TW