MATRIX THERMAL SENSING CIRCUIT AND HEAT DISSIPATION SYSTEM

摘要

A heat-dissipation system and a matrix thermal sensing circuit are provided. The heat-dissipation is used in an electronic device. The electronic device comprises a circuit board and a plurality of load elements disposed on the circuit board. The matrix thermal sensing circuit includes a current sensing module and a calculation module. The current sensing module includes a plurality of sensing nodes. Each sensing node is electrically connected to a current feeding terminal of one corresponding load element, and senses the working current of the corresponding load element respectively. The calculation module is connected to the current sensing module and is used to determine thermal state of the location of the sensing node according to the working current respectively.

主权项

1. A matrix thermal sensing circuit for sensing thermal distribution of a circuit board. including a plurality of load elements, comprising:
a current sensing module including a plurality of sensing nodes, wherein each sensing node is electrically connected to a current feeding terminal of at e corresponding load element and senses a working current of the corresponding load element, respectively; and a calculation module connected to the current sensing module and used to determine the thermal state of the location of the sensing node according to the working current, respectively.