SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package includes a package substrate, a semiconductor chip, a die attach film, a molding member, and a dummy finger. A bond finger is arranged on an upper surface of the package substrate. The semiconductor chip is arranged on the upper surface of the package substrate, and electrically connected to the bond finger. The die attach film is interposed between the semiconductor chip and the package substrate such that the semiconductor chip is attached to the package substrate. The molding member is formed on the upper surface of the package substrate to cover the semiconductor chip. The dummy finger is formed between the upper surface of the package substrate and the molding member. Moisture in the void formed in the die attach film may be released through the discharge passageway. Thus, the package substrate is prevented from being swollen during a subsequent thermal process such as a reflow process.

主权项

1. A semiconductor package comprising:
a package substrate including at least one bond finger; a semiconductor chip on the upper surface of the package substrate, the semiconductor chip electrically connected to the bond finger; a die attach film between the semiconductor chip and the package substrate, the die attach film attaching the semiconductor chip to the package substrate; a molding member on the upper surface of the package substrate, the molding member covering the semiconductor chip; and at least one dummy finger between the upper surface of the package substrate and the molding member.