| 发明名称 |
PACKAGE ON PACKAGE STRUCTURES AND METHODS FOR FORMING THE SAME |
| 摘要 |
A method of forming a semiconductor device package includes removing a portion of a first connector and a molding compound surrounding the first connector to form an opening, wherein the first connector is part of a first package, and removing the portion of the first connector comprises forming a surface on the first connector which is at an angle with respect to a top surface of the molding compound. The method further includes placing a second connector in the opening, wherein the second connector is part of a second package having a semiconductor die. The method further includes bonding the second connector to a remaining portion of the first connector. |
| 申请公布号 |
US2014197547(A1) |
申请公布日期 |
2014.07.17 |
| 申请号 |
US201414212233 |
申请日期 |
2014.03.14 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHENG Jung Wei;WANG Tsung-Ding;LEE Chien-Hsun;CHUANG Chun-Chih |
| 分类号 |
H01L25/065;H01L23/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a semiconductor device package, the method comprising:
removing a portion of a first connector and a molding compound surrounding the first connector to form an opening, wherein the first connector is part of a first package, and removing the portion of the first connector comprises forming a surface on the first connector which is at an angle with respect to a top surface of the molding compound; placing a second connector in the opening, wherein the second connector is part of a second package having a semiconductor die; and bonding the second connector to a remaining portion of the first connector. |
| 地址 |
Hsinchu TW |
