发明名称 Self Aligned Contact Formation
摘要 The present disclosure relates to methods of forming a self-aligned contact and related apparatus. In some embodiments, the method forms a plurality of gate lines interspersed between a plurality of dielectric lines, wherein the gate lines and the dielectric lines extend in a first direction over an active area. One or more of the plurality of gate lines are into a plurality of gate line sections aligned in the first direction. One or more of the plurality of dielectric lines are cut into a plurality of dielectric lines sections aligned in the first direction. A dummy isolation material is deposited between adjacent dielectric sections in the first direction and between adjacent gate line sections in the first direction. One or more self-aligned metal contacts are then formed by replacing a part of one or more of the plurality of dielectric lines over the active area with a contact metal.
申请公布号 US2014197499(A1) 申请公布日期 2014.07.17
申请号 US201313743523 申请日期 2013.01.17
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 Chen Neng-Kuo;Yu Shao-Ming;Huang Gin-Chen;Hsu Chia-Jung;Sun Sey-Ping;Wann Clement Hsingjen
分类号 H01L21/02;H01L29/78 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of forming a self-aligned contact, comprising: forming a plurality of gate lines interspersed between a plurality of dielectric lines, wherein the gate lines and the dielectric lines extend in a first direction over an active area; cutting one or more of the plurality of gate lines into a plurality of gate line sections aligned in the first direction; cutting one or more of the plurality of dielectric lines into a plurality of dielectric lines sections aligned in the first direction; depositing a dummy isolation material between adjacent dielectric sections in the first direction and between adjacent gate line sections in the first direction; and forming one or more self-aligned metal contacts by replacing a part of one or more of the plurality of dielectric lines over the active area with a contact metal.
地址 Hsin-Chu TW