HEAT DISSIPATION DEVICE FOR MEMORY CARDS

摘要

A heat dissipation device for a number of memory cards includes two positioning frames, a supporting bracket located above the memory cards, a fan, and four latching members. The memory cards are connected a number of memory slots. The positioning frames are mounted to opposite ends of the memory slots. The supporting bracket includes a supporting plate defining an air ventilation area aligning with the memory cards, and two mounting portions protruding from two opposite ends of the supporting plate. The fan is mounted on the supporting plate and aligning with the air ventilation area. Each mounting portion includes a first end and an opposite second end. Each latching member includes a connecting pole and a latching pole. The connecting poles are engaged with the first and second ends of the mounting portions, and the latching poles are engaged with opposite ends of the positioning frames.

主权项

1. A heat dissipation device for a plurality of memory cards connected to a plurality of memory slots, the heat dissipation device comprising:
two positioning frames mounted to opposite ends of the plurality of memory slots; a supporting bracket located above the memory cards, and comprising a supporting plate defining an air ventilation area aligning with the memory cards, and two mounting portions protruding out from two opposite ends of the supporting plate; a fan mounted on the supporting plate and aligning with the air ventilation area; and four latching members; wherein each mounting portion comprises a first end and a second end opposite to the first end, each latching member comprises a connecting pole and a latching pole which are formed at opposite ends of the latching member, the connecting poles of the latching members are engaged with the first and second ends of the mounting portions of the supporting bracket, and the latching poles of the latching members are engaged with opposite ends of the two positioning frames.