发明名称 PACKAGE STRUCTURE OF ELECTRONIC DEVICE
摘要 A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.
申请公布号 US2014198435(A1) 申请公布日期 2014.07.17
申请号 US201313934222 申请日期 2013.07.02
申请人 Industrial Technology Research Institute 发明人 Yeh Shu-Tang;Tsai Chia-Hao;Lin Mei-Ru
分类号 H05K5/02 主分类号 H05K5/02
代理机构 代理人
主权项 1. A package structure of an electronic device, comprising: a first substrate, comprising a first light-transmitting portion and a periphery portion surrounding the first light-transmitting portion; a second substrate, comprising a second light-transmitting portion and two covering portions located on two opposite sides of the second light-transmitting portion, the first light-transmitting portion and the second light-transmitting portion being disposed correspondingly, and a device disposition region being disposed therebetween, wherein the covering portions cover the periphery portion of the first substrate located on two opposite sides of the first light-transmitting portion and cover two opposite side surfaces of the first substrate; an electronic device, disposed on the first substrate or the second substrate and located in the device disposition region; and a first barrier structure, disposed on the first substrate or the second substrate, wherein the first barrier structure is disposed corresponding to the periphery portion and located on at least one side of the device disposition region.
地址 Hsinchu TW
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