| 发明名称 |
INSULATION RESIN FILM, SUBSTRATE WITH THIN METAL LAYER AND PRINTED CIRCUIT BOARD INCLUDING INSULATION RESIN FILM, AND METHOD FOR FABRICATING CIRCUIT BOARD INCLUDING INSULATION RESIN FILM |
| 摘要 |
<p>The present invention relates to an insulation film for improving the strength of adhering to the plated layer in a printed circuit board, a thin metal layer and a printed circuit board including the insulation resin film, and a method for fabricating a printed circuit board using the insulation resin film.</p> |
| 申请公布号 |
WO2014109593(A1) |
申请公布日期 |
2014.07.17 |
| 申请号 |
WO2014KR00311 |
申请日期 |
2014.01.10 |
| 申请人 |
DOOSAN CORPORATION |
发明人 |
LEE, HYUNJIN;NAM, DONGKI;PARK, HAN SUNG;RYU, EUI DOCK;KIM, WOOJEONG |
| 分类号 |
H01B5/14;H05K1/03 |
主分类号 |
H01B5/14 |
| 代理机构 |
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