| 发明名称 |
METHOD OF MANNUFACTURING A PRINTED CIRCUIT BOARD |
| 摘要 |
<p>The present invention secures the intensity of a substrate in a flip chip bonding step of a component by forming a bump on a copper foil detachable core and completely forms a printed circuit board by exposing a pad which is located on an opposite side by removing a copper foil of the detachable core. The printed circuit board according to the present invention is completely molded. Thereby, a molding part provides the intensity of the circuit board. The pad of the circuit board of the present invention and the bump of a mother board are mounted with a flip chip.</p> |
| 申请公布号 |
KR101420088(B1) |
申请公布日期 |
2014.07.17 |
| 申请号 |
KR20130093427 |
申请日期 |
2013.08.07 |
| 申请人 |
DAE DUCK ELECTRONICS CO., LTD. |
发明人 |
KIM, SANG JIN;BAE, JAE MAN |
| 分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
| 代理机构 |
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