发明名称 Improvements in or relating to semi-conductor devices
摘要 810,361. Sealed envelopes for semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES Ltd. Nov. 2, 1956 [Nov. 5, 1955], No. 33519/56. Class 37. A semi-conductor device is sealed in a cylindrical glass envelope by providing the supply wires with metal flanges equal in diameter to the internal diameter of the envelope. These leads are also provided with notches near the flanges so that they may be broken off at a suitable point after the sealing has been accomplished.
申请公布号 GB810361(A) 申请公布日期 1959.03.11
申请号 GB19560033519 申请日期 1956.11.02
申请人 PHILIPS ELECTRICAL INDUSTRIES LIMITED 发明人
分类号 C03C27/02;H01J5/42;H01L23/04 主分类号 C03C27/02
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