发明名称 GROUP III NITRIDE EPITAXIAL SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a group III nitride epitaxial substrate and a manufacturing method of the same, which reduces warpage after forming a main laminate and improves a vertical breakdown voltage.SOLUTION: A group III nitride epitaxial substrate 10 of the present embodiment comprises: an Si substrate 11; an initial layer 14 having contact with the Si substrate 11; and a superlattice laminate 15 which is formed on the initial layer 14 and in which first layers 15A1 (15B1) composed of AlGaN(0.5<&alpha;&le;1) and second layers 15A2 (15B2) composed of AlGaN(0<&bgr;&le;0.5) are alternately laminated. An Al composition &bgr; of the second layer gradually increases with distance from the Si substrate.
申请公布号 JP2014132607(A) 申请公布日期 2014.07.17
申请号 JP20130000148 申请日期 2013.01.04
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 IKUTA TETSUYA;SHIBATA TOMOHIKO
分类号 H01L21/205;C23C16/34;H01L21/338;H01L29/778;H01L29/812 主分类号 H01L21/205
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