发明名称 |
GROUP III NITRIDE EPITAXIAL SUBSTRATE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a group III nitride epitaxial substrate and a manufacturing method of the same, which reduces warpage after forming a main laminate and improves a vertical breakdown voltage.SOLUTION: A group III nitride epitaxial substrate 10 of the present embodiment comprises: an Si substrate 11; an initial layer 14 having contact with the Si substrate 11; and a superlattice laminate 15 which is formed on the initial layer 14 and in which first layers 15A1 (15B1) composed of AlGaN(0.5<α≤1) and second layers 15A2 (15B2) composed of AlGaN(0<&bgr;≤0.5) are alternately laminated. An Al composition &bgr; of the second layer gradually increases with distance from the Si substrate. |
申请公布号 |
JP2014132607(A) |
申请公布日期 |
2014.07.17 |
申请号 |
JP20130000148 |
申请日期 |
2013.01.04 |
申请人 |
DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
IKUTA TETSUYA;SHIBATA TOMOHIKO |
分类号 |
H01L21/205;C23C16/34;H01L21/338;H01L29/778;H01L29/812 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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