FLEXIBLE BISMALEIMIDE, BENZOXAZINE, EPOXY-ANHYDRIDE ADDUCT HYBRID ADHESIVE

摘要

A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Preferably, a flexible epoxy anhydride adduct modified solid bismaleimide and solid benzoxazine resin composition that can survive high temperature and high moisture conditions and maintain good adhesion strength and minimize the stress resulting from a coefficient of thermal expansion mismatch between a silicon die and a substrate which is Ball Grid Array solder mask or a smart card polyethylene terephthalate or silver or copper metal lead frame.

主权项

1. A thermosetting adhesive composition for adhering materials with a dissimilar surface consisting essentially of:
a) a bismaleimide resin compound in solid form at room temperature; b) a benzoxazine resin compound in solid form at room temperature; c) one or more thermoset compounds selected from the group of epoxy, cycloaliphatic epoxy, acrylate, methacrylate, epoxy acrylate, epoxy phenol novolac, epoxy cresol novolac, phenol novolac, cresol novolac, and oxetane resin; d) optionally one or more thermoset resins and a mixture thereof; and e) epoxy phenol novolac and an anhydride adduct, epoxy cresol novolac and anhydride adduct, epoxy functional group contained polymer resin and an anhydride adduct.